符合QB BCu85Ag10P
L2010是含10%银的磷铜钎料,银的加入,可提高钎料的润湿能力及降低熔点,其接头强度、韧性、导电等综合性能较好。
L2010 is a copper-phosphorus solder containing 10% silver. The addition of silver can improve the wetting ability of the solder and lower the melting point. Its joint strength, toughness, electrical conductivity and other comprehensive properties are better.
适用于钎焊铜及铜合金、银、钨和钼等金属。多数用来钎焊冲击振动负载较小的工件,以电机制造工业使用最广。
Suitable for brazing metals such as copper and copper alloys, silver, tungsten and molybdenum. Most of them are used to braze workpieces with small shock and vibration loads, and are most widely used in the motor manufacturing industry.
| P | Ag | Cu |
| 5.3~5.7 | 9.5~10.5 | 余量 |
| 固相线 | 液相线 |
| 643 | 715 |
1. 钎焊前必须严格清除钎焊处及钎料表面的油脂、氧化物等污物。
2.钎焊铜时不需用钎焊熔剂,但钎焊铜合金必须配钎焊熔剂。
3.钎料的漫流性可凭借母材予热及钎焊温度的高低来适当调节。
1. Before brazing, the grease, oxides and other dirt on the brazing part and the surface of the solder must be strictly removed.
2. Brazing flux is not required when brazing copper, but brazing flux must be used for brazing copper alloys.
3. The flowability of the brazing filler metal can be adjusted appropriately by the preheating of the base material and the brazing temperature.
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